HY6264ALLP-70 vs EDI8465P35QI feature comparison

HY6264ALLP-70 SK Hynix Inc

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EDI8465P35QI Electronic Designs Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC ELECTRONIC DESIGNS INC
Part Package Code DIP
Package Description DIP, DIP28,.6
Pin Count 28
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 70 ns 35 ns
Additional Feature BATTERY BACKUP
I/O Type COMMON COMMON
JESD-30 Code R-PDIP-T28 R-CDIP-T24
JESD-609 Code e0 e0
Length 37 mm
Memory Density 65536 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 28 24
Number of Words 8192 words 65536 words
Number of Words Code 8000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 8KX8 64KX4
Output Characteristics 3-STATE 3-STATE
Output Enable YES NO
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm
Standby Current-Max 0.000005 A 0.0005 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.05 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 2 1

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