HY62256BLLP-70
vs
KM62256BLPI-7
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP28,.6
DIP, DIP28,.6
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
Additional Feature
BATTERY BACKUP
I/O Type
COMMON
COMMON
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
JESD-609 Code
e0
e0
Length
37 mm
36.32 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.826 mm
5.08 mm
Standby Current-Max
0.000015 A
0.00002 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.06 mA
0.07 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Pbfree Code
Compare HY62256BLLP-70 with alternatives
Compare KM62256BLPI-7 with alternatives