HY5RS123235FP-16
vs
H5RS5223CFR-N3C
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
SK HYNIX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA, BGA136,12X17,32
|
BGA, BGA136,12X17,32
|
Pin Count |
136
|
126
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.28
|
8542.32.00.28
|
Access Mode |
MULTI BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
Access Time-Max |
0.25 ns
|
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK) |
600 MHz
|
1300 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
4,8
|
4,8
|
JESD-30 Code |
R-PBGA-B136
|
R-PBGA-B126
|
JESD-609 Code |
e1
|
e1
|
Length |
14 mm
|
14 mm
|
Memory Density |
536870912 bit
|
536870912 bit
|
Memory IC Type |
DDR3 DRAM
|
DDR3 DRAM
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
136
|
126
|
Number of Words |
16777216 words
|
16777216 words
|
Number of Words Code |
16000000
|
16000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
16MX32
|
16MX32
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
BGA
|
Package Equivalence Code |
BGA136,12X17,32
|
BGA136,12X17,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
8192
|
8192
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Sequential Burst Length |
4,8
|
4,8
|
Standby Current-Max |
0.11 A
|
0.13 A
|
Supply Current-Max |
0.85 mA
|
1.05 mA
|
Supply Voltage-Max (Vsup) |
2.15 V
|
2.15 V
|
Supply Voltage-Min (Vsup) |
1.74 V
|
1.95 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
2.05 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
12 mm
|
10 mm
|
Base Number Matches |
1
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare HY5RS123235FP-16 with alternatives
Compare H5RS5223CFR-N3C with alternatives