HY5MS7B2LFP-H
vs
K4S563233F-FG1L0
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
VFBGA,
TFBGA,
Pin Count
90
90
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Category CO2 Kg
12
12
Compliance Temperature Grade
Commercial Extended: -25C to +85C
Commercial Extended: -25C to +85C
EU RoHS Version
RoHS 2 (2011/65/EU)
EFUP
e
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
6.5 ns
7 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B90
R-PBGA-B90
JESD-609 Code
e1
Length
13 mm
13 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
DDR1 DRAM
SYNCHRONOUS DRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
90
90
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-25 °C
Organization
8MX32
8MX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.95 V
3.6 V
Supply Voltage-Min (Vsup)
1.7 V
2.7 V
Supply Voltage-Nom (Vsup)
1.8 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
OTHER
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
10 mm
8 mm
Base Number Matches
1
1
Candidate List Date
2011-06-20
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
30
Compare HY5MS7B2LFP-H with alternatives
Compare K4S563233F-FG1L0 with alternatives