HY5DW283222BF-36
vs
K4D263238E-VC330
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SK HYNIX INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA, BGA144,12X12,32
|
LFBGA,
|
| Pin Count |
144
|
144
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.02
|
| Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
0.6 ns
|
0.55 ns
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| Clock Frequency-Max (fCLK) |
278 MHz
|
|
| I/O Type |
COMMON
|
|
| Interleaved Burst Length |
2,4,8
|
|
| JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
| JESD-609 Code |
e0
|
e1
|
| Length |
12 mm
|
12 mm
|
| Memory Density |
134217728 bit
|
134217728 bit
|
| Memory IC Type |
DDR1 DRAM
|
DDR1 DRAM
|
| Memory Width |
32
|
32
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
144
|
144
|
| Number of Words |
4194304 words
|
4194304 words
|
| Number of Words Code |
4000000
|
4000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
65 °C
|
| Operating Temperature-Min |
|
|
| Organization |
4MX32
|
4MX32
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA144,12X12,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
4096
|
|
| Seated Height-Max |
1.3 mm
|
1.4 mm
|
| Self Refresh |
YES
|
YES
|
| Sequential Burst Length |
2,4,8
|
|
| Standby Current-Max |
0.05 A
|
|
| Supply Current-Max |
0.4 mA
|
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.94 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
12 mm
|
12 mm
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare HY5DW283222BF-36 with alternatives
Compare K4D263238E-VC330 with alternatives