HY5DW113222FM-22
vs
HY5DW113222FM-28
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
SK HYNIX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LFBGA,
|
LFBGA,
|
Pin Count |
144
|
144
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.28
|
8542.32.00.28
|
Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
Access Time-Max |
0.6 ns
|
0.6 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
Length |
12 mm
|
12 mm
|
Memory Density |
536870912 bit
|
536870912 bit
|
Memory IC Type |
DDR DRAM
|
DDR DRAM
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
144
|
144
|
Number of Words |
16777216 words
|
16777216 words
|
Number of Words Code |
16000000
|
16000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
16MX32
|
16MX32
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.3 mm
|
1.3 mm
|
Self Refresh |
YES
|
YES
|
Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
12 mm
|
12 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare HY5DW113222FM-22 with alternatives
Compare HY5DW113222FM-28 with alternatives