HY5DW113222FM-2
vs
HY5DS113222FM-4
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
SK HYNIX INC
Part Package Code
BGA
BGA
Package Description
LFBGA,
LFBGA, BGA144,12X12,32
Pin Count
144
144
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.6 ns
0.6 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
Length
12 mm
12 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
DDR DRAM
DDR1 DRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
16MX32
16MX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.3 mm
1.3 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
2.625 V
2.1 V
Supply Voltage-Min (Vsup)
2.375 V
1.75 V
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
12 mm
12 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
250 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8
Output Characteristics
3-STATE
Package Equivalence Code
BGA144,12X12,32
Refresh Cycles
4096
Sequential Burst Length
2,4,8
Standby Current-Max
0.05 A
Supply Current-Max
0.62 mA
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