HY5DU56422BF-J
vs
V58C2256404SALS6
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
MOSEL-VITELIC
Part Package Code
BGA
Package Description
TBGA, BGA60,9X12,40/32
,
Pin Count
60
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
0.7 ns
Additional Feature
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
166 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8
JESD-30 Code
R-PBGA-B60
Length
13 mm
Memory Density
268435456 bit
Memory IC Type
DDR1 DRAM
Memory Width
4
Number of Functions
1
Number of Ports
1
Number of Terminals
60
Number of Words
67108864 words
Number of Words Code
64000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
64MX4
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
TBGA
Package Equivalence Code
BGA60,9X12,40/32
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Refresh Cycles
8192
Seated Height-Max
1.17 mm
Self Refresh
YES
Sequential Burst Length
2,4,8
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
8 mm
Base Number Matches
1
2
Compare HY5DU56422BF-J with alternatives