HY57W2A3220LT-HC
vs
K4M56323PG-FG900
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
TSOP2
|
BGA
|
Package Description |
TSOP2, TSSOP86,.46,20
|
VFBGA, BGA90,9X15,32
|
Pin Count |
86
|
90
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.02
|
8542.32.00.24
|
Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
Access Time-Max |
5.4 ns
|
7 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK) |
133 MHz
|
111 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
1,2,4,8
|
1,2,4,8
|
JESD-30 Code |
R-PDSO-G86
|
R-PBGA-B90
|
Length |
22.238 mm
|
13 mm
|
Memory Density |
134217728 bit
|
268435456 bit
|
Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
Memory Width |
32
|
32
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
86
|
90
|
Number of Words |
4194304 words
|
8388608 words
|
Number of Words Code |
4000000
|
8000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
80 °C
|
85 °C
|
Operating Temperature-Min |
-10 °C
|
-25 °C
|
Organization |
4MX32
|
8MX32
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSOP2
|
VFBGA
|
Package Equivalence Code |
TSSOP86,.46,20
|
BGA90,9X15,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
4096
|
4096
|
Seated Height-Max |
1.194 mm
|
1 mm
|
Self Refresh |
YES
|
YES
|
Sequential Burst Length |
1,2,4,8,FP
|
1,2,4,8,FP
|
Standby Current-Max |
0.0006 A
|
0.0003 A
|
Supply Voltage-Max (Vsup) |
2.7 V
|
1.95 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
10.16 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
Supply Current-Max |
|
0.14 mA
|
|
|
|
Compare HY57W2A3220LT-HC with alternatives
Compare K4M56323PG-FG900 with alternatives