HY57V651610ALTC-10S
vs
UPD4565161G5-A10-9JF
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
NEC ELECTRONICS CORP
|
Part Package Code |
TSOP2
|
TSOP2
|
Package Description |
TSOP2,
|
TSOP2,
|
Pin Count |
54
|
54
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.02
|
8542.32.00.02
|
Access Mode |
DUAL BANK PAGE BURST
|
DUAL BANK PAGE BURST
|
Access Time-Max |
6 ns
|
6 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
JESD-30 Code |
R-PDSO-G54
|
R-PDSO-G54
|
JESD-609 Code |
e6
|
|
Length |
22.22 mm
|
22.22 mm
|
Memory Density |
67108864 bit
|
67108864 bit
|
Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
54
|
54
|
Number of Words |
4194304 words
|
4194304 words
|
Number of Words Code |
4000000
|
4000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
4MX16
|
4MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSOP2
|
TSOP2
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
MOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN BISMUTH
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
10.16 mm
|
10.16 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare HY57V651610ALTC-10S with alternatives
Compare UPD4565161G5-A10-9JF with alternatives