HY53C464F-80
vs
TMS4464-20FML
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
TEXAS INSTRUMENTS INC
Part Package Code
LCC
Package Description
QCCJ, LDCC18,.33X.53
QCCJ, LDCC18,.33X.53
Pin Count
18
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FAST PAGE
PAGE
Access Time-Max
80 ns
200 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
RAS ONLY/CAS BEFORE RAS REFRESH
I/O Type
COMMON
COMMON
JESD-30 Code
R-PQCC-J18
R-PQCC-J18
JESD-609 Code
e0
Length
12.446 mm
12.446 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
FAST PAGE DRAM
PAGE MODE DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
18
18
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX4
64KX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC18,.33X.53
LDCC18,.33X.53
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
256
256
Seated Height-Max
3.55 mm
3.53 mm
Standby Current-Max
0.002 A
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
NMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
7.366 mm
7.366 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HY53C464F-80 with alternatives
Compare TMS4464-20FML with alternatives