HY29LV400BF-55I
vs
S29PL064J55BAW121
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SK HYNIX INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
TFBGA, BGA48,6X8,32
|
FBGA-48
|
| Pin Count |
48
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
55 ns
|
55 ns
|
| Alternate Memory Width |
8
|
|
| Boot Block |
BOTTOM
|
BOTTOM/TOP
|
| Command User Interface |
YES
|
YES
|
| Data Polling |
YES
|
YES
|
| Endurance |
100000 Write/Erase Cycles
|
|
| JESD-30 Code |
R-PBGA-B48
|
R-PBGA-B48
|
| JESD-609 Code |
e1
|
e0
|
| Length |
8 mm
|
8.15 mm
|
| Memory Density |
4194304 bit
|
67108864 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
1,2,1,7
|
16,126
|
| Number of Terminals |
48
|
48
|
| Number of Words |
262144 words
|
4194304 words
|
| Number of Words Code |
256000
|
4000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Organization |
256KX16
|
4MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA48,6X8,32
|
BGA48,6X8,32
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
YES
|
| Seated Height-Max |
1.1 mm
|
1 mm
|
| Sector Size |
16K,8K,32K,64K
|
4K,32K
|
| Standby Current-Max |
0.000005 A
|
0.000005 A
|
| Supply Current-Max |
0.03 mA
|
0.07 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Toggle Bit |
YES
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
6 mm
|
6.15 mm
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
No
|
| Additional Feature |
|
TOP AND BOTTOM BOOT BLOCK
|
| Common Flash Interface |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Page Size |
|
8 words
|
| Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare HY29LV400BF-55I with alternatives
Compare S29PL064J55BAW121 with alternatives