HY29LV320TF-80
vs
MBM29DL322TE-80PBT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA63,8X12,32
PLASTIC, FBGA-63
Pin Count
63
63
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
80 ns
80 ns
Boot Block
TOP
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
JESD-609 Code
e1
Length
11 mm
11 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
1,2,1,63
Number of Terminals
63
63
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-20 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA63,8X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
8K,4K,16K,32K
Standby Current-Max
0.000005 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
Width
7 mm
7 mm
Base Number Matches
1
1
Alternate Memory Width
8
Compare HY29LV320TF-80 with alternatives
Compare MBM29DL322TE-80PBT with alternatives