HY29F200T-70
vs
HY29F200T-70E
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
SK HYNIX INC
|
Part Package Code |
TSOP
|
TSOP
|
Package Description |
TSOP-48
|
TSOP-48
|
Pin Count |
48
|
48
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
3A001.A.2.C
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
70 ns
|
70 ns
|
Additional Feature |
100K PROGRAM/ERASE CYCLE
|
100K PROGRAM/ERASE CYCLE
|
Alternate Memory Width |
16
|
16
|
JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
JESD-609 Code |
e6
|
e6
|
Length |
18.4 mm
|
18.4 mm
|
Memory Density |
2097152 bit
|
2097152 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
48
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Organization |
256KX8
|
256KX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSOP1
|
TSOP1
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
5 V
|
5 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
TIN BISMUTH
|
TIN BISMUTH
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Type |
NOR TYPE
|
NOR TYPE
|
Width |
12 mm
|
12 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare HY29F200T-70 with alternatives
Compare HY29F200T-70E with alternatives