HY29F040P-70I vs MX29F040CPC-70G feature comparison

HY29F040P-70I SK Hynix Inc

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MX29F040CPC-70G Macronix International Co Ltd

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC MACRONIX INTERNATIONAL CO LTD
Part Package Code DIP DIP
Package Description PLASTIC, DIP-32 DIP,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
JESD-30 Code R-PDIP-T32 R-PDIP-T32
Length 42.037 mm 41.91 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm 4.9 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Type NOR TYPE
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
Rohs Code Yes
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compare HY29F040P-70I with alternatives

Compare MX29F040CPC-70G with alternatives