HY29F040-15PDI vs W29C040-15C feature comparison

HY29F040-15PDI SK Hynix Inc

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W29C040-15C Winbond Electronics Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC WINBOND ELECTRONICS CORP
Part Package Code DIP DIP
Package Description PLASTIC, DIP-32 0.600 INCH, PLASTIC, DIP-32
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 150 ns 150 ns
JESD-30 Code R-PDIP-T32 R-PDIP-T32
Length 42.037 mm 41.91 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.826 mm 5.33 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 15.24 mm 15.24 mm
Base Number Matches 1 1
JESD-609 Code e3
Terminal Finish MATTE TIN
Write Cycle Time-Max (tWC) 10 ms

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