HY27US08121A-SPIP vs HY27US08121A-TMB feature comparison

HY27US08121A-SPIP SK Hynix Inc

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HY27US08121A-TMB SK Hynix Inc

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC SK HYNIX INC
Part Package Code SOIC TSOP1
Package Description VSSOP, TSSOP48,.71,20 TSOP1,
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 30 ns 30 ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 15.4 mm 18.4 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Sectors/Size 4K
Number of Terminals 48 48
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -30 °C
Organization 64MX8 64MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP TSOP1
Package Equivalence Code TSSOP48,.71,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE
Page Size 512 words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Programming Voltage 3.3 V 3.3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 0.65 mm 1.2 mm
Sector Size 16K
Standby Current-Max 0.00005 A
Supply Current-Max 0.02 mA 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Toggle Bit NO
Type SLC NAND TYPE SLC NAND TYPE
Width 12 mm 12 mm
Base Number Matches 1 1

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