HY27US08121A-SPIP
vs
HY27US08121A-TMB
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
SK HYNIX INC
Part Package Code
SOIC
TSOP1
Package Description
VSSOP, TSSOP48,.71,20
TSOP1,
Pin Count
48
48
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
30 ns
30 ns
Command User Interface
YES
Data Polling
NO
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Length
15.4 mm
18.4 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Sectors/Size
4K
Number of Terminals
48
48
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-30 °C
Organization
64MX8
64MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSSOP
TSOP1
Package Equivalence Code
TSSOP48,.71,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE
Page Size
512 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Programming Voltage
3.3 V
3.3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
0.65 mm
1.2 mm
Sector Size
16K
Standby Current-Max
0.00005 A
Supply Current-Max
0.02 mA
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
NOT SPECIFIED
Toggle Bit
NO
Type
SLC NAND TYPE
SLC NAND TYPE
Width
12 mm
12 mm
Base Number Matches
1
1
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