HY27SS08121A-FMP vs HY27SS08121A-FCP feature comparison

HY27SS08121A-FMP SK Hynix Inc

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HY27SS08121A-FCP SK Hynix Inc

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Pbfree Code Yes Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC SK HYNIX INC
Part Package Code BGA BGA
Package Description VFBGA, VFBGA, BGA63,10X12,32
Pin Count 63 63
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 40 ns 40 ns
JESD-30 Code R-PBGA-B63 R-PBGA-B63
JESD-609 Code e1 e0
Length 11 mm 11 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -30 °C
Organization 64MX8 64MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Current-Max 0.015 mA 0.015 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type SLC NAND TYPE SLC NAND TYPE
Width 9 mm 9 mm
Base Number Matches 1 1
Command User Interface YES
Data Polling NO
Number of Sectors/Size 4K
Package Equivalence Code BGA63,10X12,32
Page Size 512 words
Ready/Busy YES
Sector Size 16K
Standby Current-Max 0.00005 A
Toggle Bit NO

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