HY27SG162G2M-TPES vs NAND02GW4B3CN6T feature comparison

HY27SG162G2M-TPES SK Hynix Inc

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NAND02GW4B3CN6T STMicroelectronics

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SK HYNIX INC STMICROELECTRONICS
Part Package Code TSOP1 TSOP
Package Description TSOP1, TSSOP48,.8,20 TSOP1,
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 30 ns 35 ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e6 e0
Length 18.4 mm 18.4 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Sectors/Size 2K
Number of Terminals 48 48
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 128MX16 128MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Page Size 1K words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 3 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm 1.2 mm
Sector Size 64K
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 1.95 V 3.6 V
Supply Voltage-Min (Vsup) 1.7 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN BISMUTH TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Toggle Bit NO
Type SLC NAND TYPE
Width 12 mm 12 mm
Base Number Matches 1 1

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