HY27SG162G2M-TPES
vs
NAND02GR4B2BN6E
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
MICRON TECHNOLOGY INC
Part Package Code
TSOP1
TSOP
Package Description
TSOP1, TSSOP48,.8,20
TSSOP,
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
30 ns
35 ns
Command User Interface
YES
Data Polling
NO
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e6
e3
Length
18.4 mm
18.4 mm
Memory Density
2147483648 bit
2147483648 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
2K
Number of Terminals
48
48
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-40 °C
Organization
128MX16
128MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSSOP
Package Equivalence Code
TSSOP48,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Page Size
1K words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
64K
Standby Current-Max
0.0001 A
Supply Current-Max
0.02 mA
0.015 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN BISMUTH
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Toggle Bit
NO
Type
SLC NAND TYPE
NAND TYPE
Width
12 mm
12 mm
Base Number Matches
1
1
Compare HY27SG162G2M-TPES with alternatives
Compare NAND02GR4B2BN6E with alternatives