HY27SG082G2M-TPC
vs
HY27SG082G2M-TI
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
SK HYNIX INC
|
Package Description |
TSSOP, TSSOP48,.8,20
|
TSSOP, TSSOP48,.8,20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
45 ns
|
45 ns
|
Command User Interface |
YES
|
YES
|
Data Polling |
NO
|
NO
|
JESD-30 Code |
R-PDSO-G48
|
R-PDSO-G48
|
JESD-609 Code |
e3
|
|
Memory Density |
2147483648 bit
|
2147483648 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Moisture Sensitivity Level |
1
|
1
|
Number of Sectors/Size |
2K
|
2K
|
Number of Terminals |
48
|
48
|
Number of Words |
268435456 words
|
268435456 words
|
Number of Words Code |
256000000
|
256000000
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
256MX8
|
256MX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP48,.8,20
|
TSSOP48,.8,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Page Size |
2K words
|
2K words
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
YES
|
Sector Size |
128K
|
128K
|
Standby Current-Max |
0.0001 A
|
0.0001 A
|
Supply Current-Max |
0.02 mA
|
0.02 mA
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Toggle Bit |
NO
|
NO
|
Base Number Matches |
1
|
1
|
|
|
|
Compare HY27SG082G2M-TPC with alternatives
Compare HY27SG082G2M-TI with alternatives