HY27SF081G2M-TPEB vs HY27SF081G2M-SPEB feature comparison

HY27SF081G2M-TPEB SK Hynix Inc

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HY27SF081G2M-SPEB SK Hynix Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SK HYNIX INC SK HYNIX INC
Part Package Code TSOP1 SOIC
Package Description TSOP1, TSSOP48,.8,20 VSSOP, TSSOP48,.71,20
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 30 ns 30 ns
Command User Interface YES YES
Data Polling NO NO
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e6
Length 18.4 mm 15.4 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Sectors/Size 1K 1K
Number of Terminals 48 48
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 128MX8 128MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 VSSOP
Package Equivalence Code TSSOP48,.8,20 TSSOP48,.71,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Page Size 2K words 2K words
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1.2 mm 0.65 mm
Sector Size 128K 128K
Standby Current-Max 0.00005 A 0.00005 A
Supply Current-Max 0.015 mA 0.015 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Toggle Bit NO NO
Type SLC NAND TYPE SLC NAND TYPE
Width 12 mm 12 mm
Base Number Matches 1 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 20

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