HY27SF081G2M-TIS
vs
HY27SF081G2M-SCP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SK HYNIX INC
SK HYNIX INC
Part Package Code
TSOP1
SOIC
Package Description
TSOP1, TSSOP48,.8,20
VSSOP, TSSOP48,.71,20
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
30 ns
30 ns
Command User Interface
YES
YES
Data Polling
NO
NO
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e0
e0
Length
18.4 mm
15.4 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Sectors/Size
1K
1K
Number of Terminals
48
48
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
128MX8
128MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
VSSOP
Package Equivalence Code
TSSOP48,.8,20
TSSOP48,.71,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Page Size
2K words
2K words
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
1.8 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Seated Height-Max
1.2 mm
0.65 mm
Sector Size
128K
128K
Standby Current-Max
0.00005 A
0.00005 A
Supply Current-Max
0.015 mA
0.015 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Toggle Bit
NO
NO
Type
SLC NAND TYPE
SLC NAND TYPE
Width
12 mm
12 mm
Base Number Matches
1
1
Compare HY27SF081G2M-TIS with alternatives
Compare HY27SF081G2M-SCP with alternatives