HY27SA161G1M-FPIB
vs
AM29DL640H55WHF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
SPANSION INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
TFBGA, BGA63,8X12,32
|
12 X 11 MM, 0.80 MM PITCH, FBGA-63
|
Pin Count |
63
|
63
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
12000 ns
|
55 ns
|
Command User Interface |
YES
|
|
Data Polling |
NO
|
|
JESD-30 Code |
R-PBGA-B63
|
R-PBGA-B63
|
JESD-609 Code |
e1
|
e1
|
Length |
15 mm
|
12 mm
|
Memory Density |
1073741824 bit
|
67108864 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Sectors/Size |
8K
|
|
Number of Terminals |
63
|
63
|
Number of Words |
67108864 words
|
4194304 words
|
Number of Words Code |
64000000
|
4000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
64MX16
|
4MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA63,8X12,32
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Page Size |
256 words
|
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
1.8 V
|
3 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Ready/Busy |
YES
|
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Sector Size |
8K
|
|
Standby Current-Max |
0.0001 A
|
|
Supply Current-Max |
0.02 mA
|
|
Supply Voltage-Max (Vsup) |
1.95 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Toggle Bit |
NO
|
|
Type |
SLC NAND TYPE
|
NOR TYPE
|
Width |
8.5 mm
|
11 mm
|
Base Number Matches |
1
|
1
|
Alternate Memory Width |
|
8
|
Boot Block |
|
BOTTOM/TOP
|
Moisture Sensitivity Level |
|
3
|
|
|
|
Compare HY27SA161G1M-FPIB with alternatives
Compare AM29DL640H55WHF with alternatives