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HVCS2010BDL3M28 vs HVC2010L3284BSBU feature comparison

HVCS2010BDL3M28 SEI Stackpole Electronics Inc

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HVC2010L3284BSBU Ohmcraft

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Active Contact Manufacturer
Ihs Manufacturer STACKPOLE ELECTRONICS INC OHMCRAFT
Package Description SMT, 2010
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e0 e0
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 150 °C 150 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.76 mm 0.76 mm
Package Length 5.08 mm 5.08 mm
Package Style SMT SMT
Package Width 2.54 mm 2.54 mm
Packing Method TR, PLASTIC, 7 INCH Bulk
Rated Power Dissipation (P) 1 W 1 W
Rated Temperature 70 °C
Resistance 3280000 Ω 3280000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier Tin/Lead (Sn63Pb37)
Terminal Shape WRAPAROUND
Tolerance 0.1% 0.1%
Working Voltage 2000 V 2000 V
Base Number Matches 1 1
Series HVC
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

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