HVCB2010GTM820M
vs
HVCZ2010GDM820M
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STACKPOLE ELECTRONICS INC
|
STACKPOLE ELECTRONICS INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e3
|
e3
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.76 mm
|
0.76 mm
|
| Package Length |
5.08 mm
|
5.08 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.54 mm
|
2.54 mm
|
| Packing Method |
TR, Plastic, 7 Inch
|
TR, Plastic, 7 Inch
|
| Rated Power Dissipation (P) |
1 W
|
1 W
|
| Resistance |
820000000 Ω
|
820000000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
2010
|
2010
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
300 ppm/°C
|
300 ppm/°C
|
| Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
| Tolerance |
2%
|
2%
|
| Working Voltage |
1700 V
|
1700 V
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
SMT, 2010
|
|
|
|
Compare HVCB2010GTM820M with alternatives
Compare HVCZ2010GDM820M with alternatives