HVCB2010FHC10M0
vs
HVCB2010FKC10M0
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STACKPOLE ELECTRONICS INC
STACKPOLE ELECTRONICS INC
Package Description
CHIP
SMT, 2010
Reach Compliance Code
unknown
compliant
Factory Lead Time
13 Weeks
16 Weeks
Samacsys Manufacturer
Stackpole Electronics, Inc.
Stackpole Electronics, Inc.
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.76 mm
0.76 mm
Package Length
5.08 mm
5.08 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.54 mm
2.54 mm
Packing Method
TR
TR, PLASTIC, 7 INCH
Rated Power Dissipation (P)
1 W
1 W
Rated Temperature
70 °C
70 °C
Resistance
10000000 Ω
10000000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
50 ppm/°C
50 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
MATTE TIN OVER NICKEL
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
2000 V
2000 V
Base Number Matches
1
1
Pbfree Code
Rohs Code
ECCN Code
EAR99
HTS Code
8533.21.00.30
Construction
Rectangular
Compare HVCB2010FHC10M0 with alternatives
Compare HVCB2010FKC10M0 with alternatives