HVCB2010FHC10M0
vs
HVC2010H1005FT
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Contact Manufacturer
Ihs Manufacturer
STACKPOLE ELECTRONICS INC
OHMCRAFT
Package Description
CHIP
Reach Compliance Code
unknown
compliant
Factory Lead Time
13 Weeks
Samacsys Manufacturer
Stackpole Electronics, Inc.
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.76 mm
0.76 mm
Package Length
5.08 mm
5.08 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.54 mm
2.54 mm
Packing Method
TR
BULK; TR
Rated Power Dissipation (P)
1 W
1 W
Rated Temperature
70 °C
75 °C
Resistance
10000000 Ω
10000000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
50 ppm/°C
50 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
2000 V
2000 V
Base Number Matches
1
1
Rohs Code
Yes
ECCN Code
EAR99
Additional Feature
PRECISION
Construction
Rectangular
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Compare HVC2010H1005FT with alternatives