HVC2010K6655FZFP
vs
HVCZ2010FBD66M5
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Contact Manufacturer
|
Active
|
Ihs Manufacturer |
OHMCRAFT
|
STACKPOLE ELECTRONICS INC
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Construction |
Chip
|
Rectangular
|
JESD-609 Code |
e3
|
e3
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.76 mm
|
0.76 mm
|
Package Length |
5.08 mm
|
5.08 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
2.54 mm
|
2.54 mm
|
Rated Power Dissipation (P) |
1 W
|
1 W
|
Resistance |
66500000 Ω
|
66500000 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Series |
HVC
|
|
Size Code |
2010
|
2010
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Matte Tin (Sn) - with Nickel (Ni) barrier
|
Tolerance |
1%
|
1%
|
Working Voltage |
2000 V
|
2000 V
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Package Description |
|
SMT, 2010
|
HTS Code |
|
8533.21.00.30
|
Mounting Feature |
|
SURFACE MOUNT
|
Packing Method |
|
BULK
|
Rated Temperature |
|
70 °C
|
Surface Mount |
|
YES
|
Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare HVC2010K6655FZFP with alternatives
Compare HVCZ2010FBD66M5 with alternatives