HVC2010H7773BBFP
vs
HVCS2010BBC777K
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
OHMCRAFT
|
STACKPOLE ELECTRONICS INC
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
Rectangular
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.76 mm
|
0.76 mm
|
| Package Length |
5.08 mm
|
5.08 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.54 mm
|
2.54 mm
|
| Rated Power Dissipation (P) |
1 W
|
1 W
|
| Resistance |
777000 Ω
|
777000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Series |
HVC
|
|
| Size Code |
2010
|
2010
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
50 ppm/°C
|
50 ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn63Pb37) - with Nickel (Ni) barrier
|
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
|
| Tolerance |
0.1%
|
0.1%
|
| Working Voltage |
2000 V
|
2000 V
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Package Description |
|
SMT, 2010
|
| HTS Code |
|
8533.21.00.30
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Packing Method |
|
BULK
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare HVC2010H7773BBFP with alternatives
Compare HVCS2010BBC777K with alternatives