HVC2010H2675DSFP
vs
MCH2010H2675DBTR
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Contact Manufacturer
|
| Ihs Manufacturer |
OHMCRAFT
|
OHMCRAFT
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.76 mm
|
0.76 mm
|
| Package Length |
5.08 mm
|
5.08 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
2.54 mm
|
2.54 mm
|
| Rated Power Dissipation (P) |
1 W
|
1 W
|
| Resistance |
26700000 Ω
|
26700000 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Series |
HVC
|
MCH
|
| Size Code |
2010
|
2010
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
50 ppm/°C
|
50 ppm/°C
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
Tin/Lead (Sn63Pb37) - with Nickel (Ni) barrier
|
| Tolerance |
0.5%
|
0.5%
|
| Working Voltage |
2000 V
|
2000 V
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Packing Method |
|
TR
|
|
|
|
Compare HVC2010H2675DSFP with alternatives
Compare MCH2010H2675DBTR with alternatives