HVC133 vs BAP63-03,115 feature comparison

HVC133 Renesas Electronics Corporation

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BAP63-03,115 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Package Description UFP, 2 PIN PLASTIC, SMD, SC-76, 2 PIN
Pin Count 2 2
Reach Compliance Code compliant unknown
HTS Code 8541.10.00.80 8541.10.00.70
Application SWITCHING ATTENUATOR; SWITCHING
Breakdown Voltage-Min 30 V 50 V
Configuration SINGLE SINGLE
Diode Capacitance-Max 1 pF 0.32 pF
Diode Element Material SILICON SILICON
Diode Forward Resistance-Max 0.7 Ω 1.5 Ω
Diode Type PIN DIODE PIN DIODE
Frequency Band HIGH FREQUENCY S BAND
JESD-30 Code R-PDSO-F2 R-PDSO-G2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 125 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Dissipation-Max 0.15 W 0.5 W
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE
Terminal Form FLAT GULL WING
Terminal Position DUAL DUAL
Base Number Matches 2 1
Rohs Code Yes
Part Package Code SOD
Manufacturer Package Code SOD323
Samacsys Manufacturer NXP
Diode Capacitance-Nom 0.4 pF
Diode Res Test Current 0.5 mA
Diode Res Test Frequency 100 MHz
JESD-609 Code e3
Minority Carrier Lifetime-Nom 0.31 µs
Operating Temperature-Min -65 °C
Peak Reflow Temperature (Cel) 260
Reverse Test Voltage
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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