HVC0805L3162DZTR
vs
HVC0805L3162DGFP
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Contact Manufacturer
|
Contact Manufacturer
|
Ihs Manufacturer |
OHMCRAFT
|
OHMCRAFT
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Construction |
Chip
|
Chip
|
JESD-609 Code |
e3
|
e4
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.64 mm
|
0.64 mm
|
Package Length |
2.01 mm
|
2.01 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
1.27 mm
|
1.27 mm
|
Packing Method |
TR
|
|
Rated Power Dissipation (P) |
0.2 W
|
0.2 W
|
Resistance |
31600 Ω
|
31600 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Series |
HVC
|
HVC
|
Size Code |
0805
|
0805
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Gold (Au)
|
Tolerance |
0.5%
|
0.5%
|
Working Voltage |
600 V
|
600 V
|
Base Number Matches |
1
|
1
|
|
|
|
Compare HVC0805L3162DZTR with alternatives
Compare HVC0805L3162DGFP with alternatives