HVC0603L1132FTBU
vs
MCH0603L1132FBBU
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Contact Manufacturer
|
Contact Manufacturer
|
Ihs Manufacturer |
OHMCRAFT
|
OHMCRAFT
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
Construction |
Chip
|
Chip
|
JESD-609 Code |
e3
|
e0
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Height |
0.51 mm
|
0.51 mm
|
Package Length |
1.6 mm
|
1.6 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
0.79 mm
|
0.79 mm
|
Packing Method |
Bulk
|
Bulk
|
Rated Power Dissipation (P) |
0.06 W
|
0.06 W
|
Resistance |
11300 Ω
|
11300 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Series |
HVC
|
MCH
|
Size Code |
0603
|
0603
|
Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
Temperature Coefficient |
200 ppm/°C
|
200 ppm/°C
|
Terminal Finish |
Matte Tin (Sn) - with Nickel (Ni) barrier
|
Tin/Lead (Sn63Pb37) - with Nickel (Ni) barrier
|
Tolerance |
1%
|
1%
|
Working Voltage |
400 V
|
400 V
|
Base Number Matches |
1
|
1
|
|
|
|
Compare HVC0603L1132FTBU with alternatives
Compare MCH0603L1132FBBU with alternatives