HUF76639S3ST_F085 vs BUK7227-100B feature comparison

HUF76639S3ST_F085 onsemi

Buy Now Datasheet

BUK7227-100B NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ON SEMICONDUCTOR NXP SEMICONDUCTORS
Package Description SMALL OUTLINE, R-PSSO-G2 PLASTIC, SC-63, DPAK-3
Manufacturer Package Code TO263A02
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Additional Feature ULTRA LOW RESISTANCE
Case Connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 100 V 100 V
Drain Current-Max (ID) 50 A 48 A
Drain-source On Resistance-Max 0.026 Ω 0.027 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-263AB TO-252
JESD-30 Code R-PSSO-G2 R-PSSO-G2
JESD-609 Code e3 e3
Moisture Sensitivity Level 1 1
Number of Elements 1 1
Number of Terminals 2 2
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 175 °C 185 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 245 260
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation-Max (Abs) 180 W 167 W
Surface Mount YES YES
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Position SINGLE SINGLE
Time@Peak Reflow Temperature-Max (s) 30 30
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code TO-252
Pin Count 3
Avalanche Energy Rating (Eas) 145 mJ
Pulsed Drain Current-Max (IDM) 196 A
Qualification Status Not Qualified

Compare HUF76639S3ST_F085 with alternatives

Compare BUK7227-100B with alternatives