HTX1H330
vs
EKMG500EBC330ME11D
feature comparison
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
NIPPON CHEMI-CON CORP
|
| Package Description |
,
|
,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Capacitance |
33 µF
|
33 µF
|
| Capacitor Type |
ALUMINUM ELECTROLYTIC CAPACITOR
|
ALUMINUM ELECTROLYTIC CAPACITOR
|
| Dielectric Material |
ALUMINUM (WET)
|
ALUMINUM (WET)
|
| ESR |
3014 mΩ
|
|
| Leakage Current |
0.0165 mA
|
0.0495 mA
|
| Manufacturer Series |
HT
|
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
THROUGH HOLE MOUNT
|
| Negative Tolerance |
20%
|
20%
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Shape |
CYLINDRICAL PACKAGE
|
CYLINDRICAL PACKAGE
|
| Polarity |
POLARIZED
|
POLARIZED
|
| Positive Tolerance |
20%
|
20%
|
| Rated (DC) Voltage (URdc) |
50 V
|
50 V
|
| Ripple Current |
260 mA
|
90 mA
|
| Surface Mount |
NO
|
NO
|
| Tan Delta |
0.06
|
0.12
|
| Terminal Shape |
WIRE
|
WIRE
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e6
|
| Packing Method |
|
BULK
|
| Terminal Finish |
|
Tin/Bismuth (Sn/Bi)
|
|
|
|
Compare HTX1H330 with alternatives
Compare EKMG500EBC330ME11D with alternatives