HSP50214BVCZ vs HSP50214VC feature comparison

HSP50214BVCZ Intersil Corporation

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HSP50214VC Harris Semiconductor

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Part Life Cycle Code Unknown Obsolete
Ihs Manufacturer INTERSIL CORP HARRIS SEMICONDUCTOR
Part Package Code MQFP
Package Description QFP,
Pin Count 120
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G120 S-PQFP-G120
JESD-609 Code e3 e0
Length 28 mm
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 120 120
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.07 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type TELECOM CIRCUIT TELECOM CIRCUIT
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 28 mm
Base Number Matches 1 1
Rohs Code No
Package Equivalence Code QFP120,1.2SQ,32
Supply Current-Max 0.364 mA

Compare HSP50214BVCZ with alternatives

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