HSP50214BVCZ
vs
HSP50214VC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Unknown
Obsolete
Ihs Manufacturer
INTERSIL CORP
HARRIS SEMICONDUCTOR
Part Package Code
MQFP
Package Description
QFP,
Pin Count
120
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G120
S-PQFP-G120
JESD-609 Code
e3
e0
Length
28 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
120
120
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Peak Reflow Temperature (Cel)
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.07 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Telecom IC Type
TELECOM CIRCUIT
TELECOM CIRCUIT
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
Width
28 mm
Base Number Matches
1
1
Rohs Code
No
Package Equivalence Code
QFP120,1.2SQ,32
Supply Current-Max
0.364 mA
Compare HSP50214BVCZ with alternatives
Compare HSP50214VC with alternatives