HSMP-3894-BLKG
vs
HSMP-3894-TR2
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
AVAGO TECHNOLOGIES INC
|
AVAGO TECHNOLOGIES INC
|
Package Description |
R-PDSO-G3
|
R-PDSO-G3
|
Pin Count |
3
|
3
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Samacsys Manufacturer |
Avago Technologies
|
|
Application |
SWITCHING
|
SWITCHING
|
Breakdown Voltage-Min |
100 V
|
100 V
|
Configuration |
COMMON CATHODE, 2 ELEMENTS
|
COMMON CATHODE, 2 ELEMENTS
|
Diode Capacitance-Max |
0.3 pF
|
0.3 pF
|
Diode Capacitance-Nom |
0.2 pF
|
0.2 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Forward Resistance-Max |
2.5 Ω
|
2.5 Ω
|
Diode Res Test Current |
1 mA
|
1 mA
|
Diode Res Test Frequency |
100 MHz
|
100 MHz
|
Diode Type |
PIN DIODE
|
PIN DIODE
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
JESD-609 Code |
e4
|
e0
|
Minority Carrier Lifetime-Nom |
0.2 µs
|
0.2 µs
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
2
|
2
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
150 °C
|
150 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Test Voltage |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Base Number Matches |
1
|
2
|
Part Package Code |
|
SOT-23
|
|
|
|
Compare HSMP-3894-BLKG with alternatives
Compare HSMP-3894-TR2 with alternatives