HSMP-386J-BLKG
vs
HSMP-3880-BLK
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
AVAGO TECHNOLOGIES INC
|
HEWLETT PACKARD CO
|
| Part Package Code |
QFN
|
SOT-23
|
| Package Description |
S-PDSO-N8
|
R-PDSO-G3
|
| Pin Count |
8
|
3
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Samacsys Manufacturer |
Avago Technologies
|
|
| Additional Feature |
LOW DISTORTION
|
LOW DISTORTION
|
| Application |
SWITCHING
|
SWITCHING
|
| Breakdown Voltage-Min |
100 V
|
100 V
|
| Configuration |
COMPLEX
|
SINGLE
|
| Diode Capacitance-Max |
1.25 pF
|
0.4 pF
|
| Diode Capacitance-Nom |
1.2 pF
|
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
0.77 Ω
|
|
| Diode Res Test Current |
50 mA
|
|
| Diode Res Test Frequency |
100 MHz
|
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
L BAND
|
VERY HIGH FREQUENCY TO L BAND
|
| JESD-30 Code |
S-PDSO-N8
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
|
| Minority Carrier Lifetime-Nom |
0.26 µs
|
2.5 µs
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
8
|
1
|
| Number of Terminals |
8
|
3
|
| Operating Temperature-Max |
150 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Dissipation-Max |
2 W
|
0.25 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Test Voltage |
50 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare HSMP-386J-BLKG with alternatives
Compare HSMP-3880-BLK with alternatives