HSMP-3866-BLKG
vs
HSMP-3866-BLKG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
AVAGO TECHNOLOGIES INC
|
BROADCOM LTD
|
| Package Description |
R-PDSO-G5
|
R-PDSO-G5
|
| Pin Count |
5
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Samacsys Manufacturer |
Avago Technologies
|
Avago Technologies
|
| Application |
ATTENUATOR
|
ATTENUATOR
|
| Breakdown Voltage-Min |
50 V
|
50 V
|
| Configuration |
COMPLEX
|
COMPLEX
|
| Diode Capacitance-Max |
0.22 pF
|
0.22 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
22 Ω
|
22 Ω
|
| Diode Res Test Current |
1 mA
|
1 mA
|
| Diode Res Test Frequency |
1 MHz
|
1 MHz
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
MEDIUM FREQUENCY TO S BAND
|
MEDIUM FREQUENCY TO S BAND
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e4
|
e4
|
| Minority Carrier Lifetime-Nom |
0.5 µs
|
0.5 µs
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
4
|
4
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Test Voltage |
50 V
|
50 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
|
|
|