HSMP-3814-BLKG
vs
LSP1002-454-2
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
AGILENT TECHNOLOGIES INC
|
MICROSEMI CORP
|
Part Package Code |
SOT-23
|
|
Package Description |
SOT-23, 3 PIN
|
ROHS COMPLIANT, PLASTIC, CASE 454-2, 3 PIN
|
Pin Count |
3
|
3
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.80
|
Additional Feature |
LOW DISTORTION
|
|
Application |
ATTENUATOR
|
ATTENUATOR
|
Breakdown Voltage-Min |
100 V
|
100 V
|
Configuration |
COMMON CATHODE, 2 ELEMENTS
|
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
|
Diode Capacitance-Max |
0.35 pF
|
0.32 pF
|
Diode Capacitance-Nom |
0.27 pF
|
0.32 pF
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Forward Resistance-Max |
3 Ω
|
4 Ω
|
Diode Type |
PIN DIODE
|
PIN DIODE
|
JESD-30 Code |
R-PDSO-G3
|
R-PDSO-N3
|
JESD-609 Code |
e3
|
|
Minority Carrier Lifetime-Nom |
1.5 µs
|
1.5 µs
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
2
|
2
|
Number of Terminals |
3
|
3
|
Operating Temperature-Max |
150 °C
|
125 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Power Dissipation-Max |
0.25 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reverse Test Voltage |
50 V
|
50 V
|
Surface Mount |
YES
|
YES
|
Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
Terminal Finish |
TIN
|
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
3
|
2
|
Manufacturer Package Code |
|
CASE 454-2
|
Diode Res Test Current |
|
100 mA
|
Diode Res Test Frequency |
|
100 MHz
|
Frequency Band |
|
C BAND
|
|
|
|
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