HSMBJ5956B
vs
MLL5956BTR
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROSEMI CORP
|
Part Package Code |
DO-214AA
|
DO-213AB
|
Package Description |
R-PDSO-C2
|
O-LELF-R2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
1200 Ω
|
|
JEDEC-95 Code |
DO-214AA
|
DO-213AB
|
JESD-30 Code |
R-PDSO-C2
|
O-LELF-R2
|
JESD-609 Code |
e0
|
e0
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
175 °C
|
Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE
|
LONG FORM
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
1.56 W
|
1.25 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
200 V
|
200 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
C BEND
|
WRAP AROUND
|
Terminal Position |
DUAL
|
END
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
1.9 mA
|
1.9 mA
|
Base Number Matches |
21
|
1
|
Additional Feature |
|
TR, 7 INCH; 1500
|
Case Connection |
|
ISOLATED
|
Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare HSMBJ5956B with alternatives
Compare MLL5956BTR with alternatives