HS3MG
vs
HS3MHR6G
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
TAIWAN SEMICONDUCTOR CO LTD
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Peak Reflow Temperature (Cel) |
250
|
250
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Package Description |
|
SMC, 2 PIN
|
HTS Code |
|
8541.10.00.80
|
Additional Feature |
|
FREE WHEELING DIODE
|
Application |
|
EFFICIENCY
|
Configuration |
|
SINGLE
|
Diode Element Material |
|
SILICON
|
Diode Type |
|
RECTIFIER DIODE
|
Forward Voltage-Max (VF) |
|
1.7 V
|
JEDEC-95 Code |
|
DO-214AB
|
JESD-30 Code |
|
R-PDSO-C2
|
Non-rep Pk Forward Current-Max |
|
150 A
|
Number of Elements |
|
1
|
Number of Phases |
|
1
|
Number of Terminals |
|
2
|
Operating Temperature-Max |
|
150 °C
|
Operating Temperature-Min |
|
-55 °C
|
Output Current-Max |
|
3 A
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Reference Standard |
|
AEC-Q101
|
Rep Pk Reverse Voltage-Max |
|
1000 V
|
Reverse Current-Max |
|
10 µA
|
Reverse Recovery Time-Max |
|
0.075 µs
|
Reverse Test Voltage |
|
1000 V
|
Surface Mount |
|
YES
|
Terminal Form |
|
C BEND
|
Terminal Position |
|
DUAL
|
|
|
|
Compare HS3MG with alternatives
Compare HS3MHR6G with alternatives