HS3140B-4Q
vs
HS3140B-3/883
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
SATCON ELECTRONICS
|
API TECHNOLOGIES CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
DIP,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
R-CDIP-T20
|
R-CDIP-T20
|
| Linearity Error-Max (EL) |
0.006%
|
0.012%
|
| Number of Bits |
14
|
14
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.429 mm
|
3.429 mm
|
| Settling Time-Nom (tstl) |
2 µs
|
2 µs
|
| Supply Voltage-Nom |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
3
|
3
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare HS3140B-4Q with alternatives
Compare HS3140B-3/883 with alternatives