HS1-0549RH-Q
vs
ADG444BRZ
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Contact Manufacturer
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
ROCHESTER ELECTRONICS LLC
|
Package Description |
DIP, DIP16,.3
|
LEAD FREE, MS-012AC, SOIC-16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
SPST
|
JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
e3
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Channels |
4
|
1
|
Number of Functions |
1
|
4
|
Number of Terminals |
16
|
16
|
On-state Resistance-Max (Ron) |
1800 Ω
|
70 Ω
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP16,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
|
Signal Current-Max |
0.008 A
|
|
Supply Current-Max (Isup) |
3 mA
|
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
NO
|
YES
|
Switch-on Time-Max |
500 ns
|
110 ns
|
Switching |
BREAK-BEFORE-MAKE
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
MATTE TIN
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Pin Count |
|
16
|
Additional Feature |
|
CAN ALSO OPERATE WITH 12V SUPPLY
|
Length |
|
9.9 mm
|
Moisture Sensitivity Level |
|
1
|
Neg Supply Voltage-Max (Vsup) |
|
-16.5 V
|
Neg Supply Voltage-Min (Vsup) |
|
-13.5 V
|
Off-state Isolation-Nom |
|
60 dB
|
On-state Resistance Match-Nom |
|
1 Ω
|
Seated Height-Max |
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
|
16.5 V
|
Supply Voltage-Min (Vsup) |
|
13.5 V
|
Switch-off Time-Max |
|
60 ns
|
Width |
|
3.9 mm
|
|
|
|
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