HPTF0603-SC-8870AT
vs
RP73PG1J887RBTDG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
VENKEL LTD
TE CONNECTIVITY LTD
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Samacsys Manufacturer
Venkel
Construction
Rectangular
Chip
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.45 mm
0.45 mm
Package Length
1.55 mm
1.55 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
0.8 mm
0.8 mm
Packing Method
TR, PAPER, 7 INCH
TR, PAPER, 7 INCH
Rated Power Dissipation (P)
0.166 W
0.166 W
Rated Temperature
70 °C
70 °C
Resistance
887 Ω
887 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0603
0603
Surface Mount
YES
YES
Technology
THIN FILM
THIN FILM
Temperature Coefficient
50 ppm/°C
50 ppm/°C
Terminal Finish
MATTE TIN OVER NICKEL
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.05%
0.1%
Working Voltage
100 V
100 V
Base Number Matches
1
1
Additional Feature
HIGH PRECISION
Reference Standard
MIL-STD-202
Compare HPTF0603-SC-8870AT with alternatives
Compare RP73PG1J887RBTDG with alternatives