HPL3-82C138-9
vs
HS9-54C138RH-Q
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
HARRIS SEMICONDUCTOR
|
| Package Description |
,
|
DFP, FL16,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
CMOS
|
CMOS
|
| Input Conditioning |
LATCHED
|
STANDARD
|
| JESD-30 Code |
R-PDIP-T16
|
R-XDFP-F16
|
| Logic IC Type |
2-LINE TO 4-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
DIP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Propagation Delay (tpd) |
50 ns
|
110 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Load Capacitance (CL) |
|
100 pF
|
| Max I(ol) |
|
0.002 A
|
| Package Equivalence Code |
|
FL16,.3
|
| Prop. Delay@Nom-Sup |
|
110 ns
|
| Screening Level |
|
38535V;38534K;883S
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
1.27 mm
|
| Total Dose |
|
100k Rad(Si) V
|
|
|
|
Compare HPL3-82C138-9 with alternatives
Compare HS9-54C138RH-Q with alternatives