HPL3-82C138-9
vs
HPL4-82C338-8
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
RENESAS ELECTRONICS CORP
|
Package Description |
,
|
QCCN, LCC20,.35SQ
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
CMOS
|
|
Input Conditioning |
LATCHED
|
|
JESD-30 Code |
R-PDIP-T16
|
S-XQCC-N20
|
Logic IC Type |
2-LINE TO 4-LINE DECODER
|
|
Number of Functions |
1
|
|
Number of Terminals |
16
|
20
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
INVERTED
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
Package Code |
DIP
|
QCCN
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Propagation Delay (tpd) |
50 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Position |
DUAL
|
QUAD
|
Base Number Matches |
2
|
3
|
Package Equivalence Code |
|
LCC20,.35SQ
|
Screening Level |
|
38535Q/M;38534H;883B
|
Terminal Pitch |
|
1.27 mm
|
|
|
|
Compare HPL3-82C138-9 with alternatives