HPCSIP-1X01-002B
vs
SIP-1X01-054B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
AMPHENOL FCI ASIA PTE LTD
AMPHENOL FCI ASIA PTE LTD
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8536.69.40.40
8536.69.40.40
Body Breadth
0.1 inch
0.1 inch
Body Depth
0.165 inch
0.173 inch
Body Length
0.1 inch
0.1 inch
Contact Configuration
RECTANGLE
RECTANGLE
Contact Finish Mating
AU ON NI
AU ON NI
Contact Finish Termination
GOLD OVER NICKEL
GOLD OVER NICKEL
Contact Material
BE-CU
BE-CU
Contact Style
RND PIN-SKT
RND PIN-SKT
Current Rating
3 A
3 A
Device Socket Type
IC SOCKET
IC SOCKET
Device Type Used On
SIP1
SIP1
Dielectric Withstanding Voltage
1000VAC V
1000VAC V
Housing Material
THERMOPLASTIC
GLASS FILLED THERMOPLASTIC
Insulation Resistance
10000000000 Ω
10000000000 Ω
Mounting Style
STRAIGHT
STRAIGHT
Number of Contacts
1
1
Operating Temperature-Max
150 °C
150 °C
Operating Temperature-Min
-55 °C
-55 °C
PCB Contact Pattern
RECTANGULAR
RECTANGULAR
Termination Type
SOLDER
SOLDER
Base Number Matches
2
2
Compare HPCSIP-1X01-002B with alternatives
Compare SIP-1X01-054B with alternatives