HP05W3F1101TEE
vs
PWC0805-1K1FPB
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ROYAL ELECTRONIC FTY CO LTD
|
TT ELECTRONICS PLC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Construction |
Chip
|
RECTANGULAR PACKAGE
|
| JESD-609 Code |
e3
|
e0
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.55 mm
|
0.6 mm
|
| Package Length |
2 mm
|
2 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.25 mm
|
1.25 mm
|
| Packing Method |
TR
|
TR, 7 INCH
|
| Rated Power Dissipation (P) |
0.333 W
|
0.25 W
|
| Resistance |
1100 Ω
|
1100 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Series |
HP
|
|
| Size Code |
0805
|
0805
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Tin/Lead (Sn60Pb40)
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
150 V
|
150 V
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
CHIP
|
| HTS Code |
|
8533.21.00.30
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Rated Temperature |
|
70 °C
|
| Surface Mount |
|
YES
|
| Terminal Shape |
|
WRAPAROUND
|
|
|
|
Compare HP05W3F1101TEE with alternatives
Compare PWC0805-1K1FPB with alternatives